I am Katie Nguyen, and hereby sincerely thank you for this opportunity to introduce myself, and for taking your time to review my qualifications. I am a graduate of San Diego State University, graduating in Bachelors of Science in electrical engineering with an average grade point of 3.0. My passion for electronics dates far back to my younger days where I was fascinated by taking things apart and assembling them back. I have always enjoyed using my hands to attain actual results.

My achievements in electronics are wide, starting with releasing of hardware description and requirements, integrated circuit design document (ICD) for a range of Auxiliary Power Systems. These included systems such as Boeing 787, APS 5000, Airbus 380, Full Authority Digital Controllers, (FADEC), specializing in the Fan Motor Controller at Hamilton Sundstrand. Concurrently, I generated reliability and safety documentation, specifically Failure Mode and Effect Analysis (FMEA) on circuit components and developed Mean Time Between Failures (MTBF) estimates. However, despite all the exciting experience at Hamilton Sundstrand, I felt an urge to explore newer innovative challenges.

This led me to General Atomic Aeronautical Systems, Inc., where I realized new, thrilling responsibilities such as working with Unmanned Aerial Vehicles, robotic airborne vehicles controlled from the ground station and flying with numerous imaging sensors and payloads. Being in the electrical integrating team that meant watching over an entire aircraft electronic system, I learn t quickly. We followed SAE 5088 aerospace standards and provisions for wiring system safety, performance, reliability and maintainability. As an integration engineer, I was involved in developing and releasing the system interconnect diagram and multiple for different aircraft platforms. While designing cable assemblies for integrated payloads, the first step involved creating a functional block diagram, followed by a wiring diagram and creating cable assembly schematic. Throughout the manufacturing process is followed in all cable designs as well as performance, weight savings, and reliability. I learn to work with the product optimization concept, minimizing costs while increasing reliability and analysis were taken for each power cable in calculating voltage drop due to cable length.

Several factors make me an extraordinary candidate for Space X. I have contributed many ideas and recommendations to process improvements and meeting customer specification during my stay at General Atomic Aeronautical Systems. Firstly, I generated engineering change from a standard 150 degree C military wire, M27500, to a process controlled wire to enhance better performance. With the 55PCXXX, a process controlled wire can withstand 600-volt, extreme light airframe wire that comes in various conductor size and jacket colors, offering high temperature rating at 200 degree C cross linked. More so, I wrote engineering change to implement the replacement of flange connector with a flangeless ones for inline disconnect cabling that takes place across all platforms of future builds. Over long flight hours, flange connector has been known to nick and or cutting through the anti-chaffing mesh in the cabling bundling. The Flangeless connector eradicates chances of nicking through the insulation sleeking on the cable. Further, to replace the solder splice with the mechanical splice that proves to be better and more reliable in cable fabrication, I released source-controlled document to implement its use.

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